The Fourth meeting of the Intergovernmental Negotiating Committee on Plastic Pollution, taking place in Ottawa between 23 and 29 April, is considering the latest draft Treaty on plastic pollution.
Articles
RSSEPS transport packaging now recognised as recyclable in practice and at scale in United Nations Environment Programme INC-4 report
Apr 23, 2024
The United Nations Environment Programme (UNEP) has acknowledged expanded polystyrene (EPS) transport packaging as an at-scale recycled material.
Global trade activity shows green shoots of recovery, led by strong growth in China and the US
Apr 22, 2024
New data from Tradeshift's Q1 Index of Global Trade Health paints an encouraging picture for global trade, with robust growth observed in China and the US, alongside indications of a rebound in global demand for manufactured goods.
ParcelCompare charts again in this year’s FT 1000 list of fastest-growing companies
Mar 26, 2024
The online parcel price comparison site ParcelCompare has again charted in the Financial Times’ eighth annual FT 1000 list of Europe’s fastest-growing companies.
Packaging robots is set to grow US$ 7.5 billion by 2032 at a CAGR of 8%
Mar 12, 2024
According to data from Fact.MR, the global packaging robots market is on a significant growth trajectory, expected to surge from US$3.8 billion in 2022 to US$7.5 billion by 2032.
Precise and fast labelling with new AP380e label applicator
Mar 04, 2024
Having a label applied accurately, precisely and wrinkle-free is important as it elevates the product presentation, a critical factor in driving sales.
G.D selects TOUGHBOOK rugged devices for its production and packaging plants
Feb 28, 2024
G.D., the Italian solutions provider to the manufacturing industry, has chosen Panasonic TOUGHBOOK devices to manage and operate its production and packaging machinery.
Advanced semiconductor packaging trends in AI and HPC
Feb 27, 2024
By Dr Yu-Han Chang, Senior Technology Analyst at IDTechEx.
Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation.
BCMPA hails Contract Pack & Fulfilment show success
Feb 27, 2024
The BCMPA hosted 24 of its members at the Contract Pack & Fulfilment (CP&F) zone at Packaging Innovations & Empack at the NEC as retailers, brand owners and entrepreneurs continued to seek the support of UK contract manufacturers, packers and eCommerce/fulfilment providers.
What to look out for at Packaging Innovations & Empack 2024
Feb 21, 2024
With a record-breaking edition of Packaging Innovations & Empack now just days away, more than 400 exhibitors are making their final preparations for the UK's flagship packaging exhibition.
